H-Series All-in-One CTP
The H-series is a fully automated CTP device with automatic loading and unloading of plates with a built-in autoloader for up to 50 plates with a thickness of 0.30 mm. It is fully compatible with CRON bridges for plate transport in all directions.
The exposing unit is based on CRON’s innovative magnetic field technology, which enables constant exposition in all resolutions. Thanks to the high level of integration, the H-series devices have extremely small dimensions. It is possible to add the PUNCH system (up to 5 sets of punches).
Class leading drum surface flatness
V-shape guide rail
Digital control
Online punching
Drum anti-air/vacuum-leakage
Constant temp. double cooling system
High capacity plate cassette
Multi-direction plate feeding
Triple dynamic drum balance
SMFO Laser technology
Multi-cassette
Dedusting system
Linear magnetic drive scanning
Side-gauge 3 point positioning system
Automatic plate and slip separating technology
LaBoo remote service
FORMATS
| Plate dimensions | Speed | |
| 26H (B3) | Max. 670×570 mm / Min. 240×240 mm | up to 50 p/h *1 |
| 36H (B2) | Max. 925×675 mm / Min. 240×240 mm | up to 60 p/h *1 |
| 46H (B1) | Max. 1163×940 mm / Min. 370×370 mm | up to 48 p/h *1 |
| 60H (B0) | Max. 1524x1200mm / Min 450x370mm | up to 38 p/h *1 |
| 70H (2B0) | Max. 1860×1422 mm）/ Min. 650×550 mm | up to 34 p/h *1 |
*1 Maximum speed at 2400 dpi resolution, with the maximum number of diodes and on standard plate format
| Plate type | Thermal CTP or UVCTPc plates of all manufacturers Plate thicknesses 0.13-0.30 mm / VLF 0.13-0.40 mm |
| Built-in resolutions | 4 – 1800+2400+2540+2800 dpi (optional 3000/3600/4000/5080/9600/10160 dpi) or newspaper 3 – 1200+1500+1800 dpi (opciono 2400 i 2540 dpi) |
| Automation | – built-in plate feeder for 100 plates – built-in output bridge adjustable for any plate developer – built-in Punch system, up to 5 sets – optional: three-way bridge with or without PUNCHes – optional: autoloaders for 50, 200, 500 or 3×50 and 5×50 plates |
Laser
| Type of laser | Thermal or UV |
| Number of diodes (speed)*2 | 16, 24, 32, 48, 64, 96 ili 128 independent*3 |
| Speed | is defined when ordering the machine |
| Head mechanism | Magnetic levitation (MagLev) with liquid cooling*4 |
| Warranty | 3 years or 200,000 plates |
*2 a larger number of diodes increases the exposing speed
*3 if one of the diodes fails, the machine continues to work
*4 movement of the head without friction and contact with the rail, no need for lubrication
Class leading drum surface flatness
V-shape guide rail
Digital control
Online punching
Drum anti-air/vacuum-leakage
Constant temp. double cooling system
High capacity plate cassette
Multi-direction plate feeding
Triple dynamic drum balance
SMFO Laser technology
Multi-cassette
Dedusting system
Linear magnetic drive scanning
Side-gauge 3 point positioning system
Automatic plate and slip separating technology
LaBoo remote service